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Stacked Back-Illuminated sensor construction overview.
Layer-by-layer preparation and imaging of advanced LGA package.
FinFET technology detailed overview.
Advanced Process Analysis techniques overview(SEM, STEM, FIB).
MEMS structure and technology overview.
V-NAND construction detailed overview - Samsung K9HQGY8S5M / K9LPGY8S1M / K9ADGD8S0A.