Teardown is an integral part of reverse engineering process of consumer electronic devices. It aims to help understanding innovative design and provide valuable knowledge on targeted product. The latest serves as a source device for further investigation of its components.

Detailed analysis of carefully disassembled device enables onboard IC’s recognition, helps to reveal functionality, identify package type, dimensions, and pin count.

Various next steps include X-ray of particular chips. This follows with more deep analysis that comes up with dice count, dice dimensions; die marking, dice general view at final metal level and go down up to active layer.

All these help designers and manufacturers to get detailed information on targeted product.